Physical Sciences & Engineering

National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)

Institutionally Coordinated Limit: 5* // Available: 5

The submission for this funding program is coordinated by the Center for Semiconductor Manufacturing.Please contact Dan Moseke, Project Director, for more information.

Applications such as high performance computing and lowpower electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging. This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).

The submission of a concept paper is required. Eligible applicants may submit only one concept paper per R&D Area. Each concept paper may only include one R&D Area. Applicants may submit separate concept papers on different R&D Areas.

 

 

Camille Dreyfus Teacher-Scholar Award

Tickets: 1 / Available: 1

The Camille Dreyfus Teacher-Scholar Awards Program supports the research and teaching careers of talented early career faculty in the chemical sciences. The Award, which requires an institutional nomination, is based on an independent body of scholarship attained in the early years of their appointment, and a demonstrated commitment to education, signaling the promise of continuing outstanding contributions to both research and teaching.
 

  • Eligibility:
    • From academic institutions in the States, Districts, and Territories of the United States of America that grant a bachelor’s or higher degree in the chemical sciences, including chemistry, biochemistry, materials chemistry, and chemical engineering.
    • Hold a full-time tenure-track academic appointment focused on the chemical sciences.
    • From Ph.D. granting departments in which scholarly research is a principal activity and undergraduate education is an important component.
    • Are within the first six years of their independent academic careers at the time of submission of the nomination. Experience has shown that awardees tend to be close to the end of their eligibility window, but all eligible candidates are welcome to apply.
Internal Deadline
External Deadline
01/30/2025

2025 Ralph E. Powe Junior Faculty Enhancement Awards

Apply to the UA internal competition  // Limit: 2 // Tickets Available: 0

Eung-Joo Lee (ECE)

Brian Kim (MSE)

 

Only two nominations are allowed per institution.

These competitive research awards provide seed money for junior faculty members that often result in additional funding from other sources. The award amount provided by ORAU is $5,000. The applicant’s institution is required to match the award with at least an additional $5,000. This is a one-year grant (June 1 to May 31).

Eligibility for the Powe Awards is open to full-time assistant professors at ORAU member institutions within two years of their tenure track appointment at the time of application. If there is a question about eligibility, your ORAU Councilor makes the final determination. Only two nominations are allowed per institution.

Junior faculty members interested in applying should consult their ORAU Councilor, and visit the frequently asked questions.

Funding Type
Internal Deadline
External Deadline
January 8, 2025

DOS DFOP0016763: 2024 FY24 EB ITSI Programs Costa Rica – Statements of Interest

Submit ticket request  // Limit:  2*  // Tickets Available: 2

 

Organizations may submit no more than two (2) SOIs and only one (1) SOI per category. The applicant must explicitly identify the category for each SOI submitted.

This solicitation is specific to Costa Rica and includes two (2) categories under which applicants may submit SOIs:
1) Workforce Development
2) Policy and Regulatory Reform

The submission of the SOI is the first step in a two-step process. Applicants must first submit a concise no more than three (3) page statement of interest designed to clearly communicate the program idea and objectives. This is not a full proposal. The purpose of the SOI process is to allow applicants to submit program ideas for evaluation prior to requiring the development of a full proposal application. Upon a merit review of eligible SOIs, selected applicants will be invited to expand on their program idea(s) by submitting a full proposal application. Full proposals will go through a second merit review before final funding decisions are made.  

 

EB administers a portion of the ITSI Fund, the “ITSI Promote” line of effort, to help expand international semiconductor assembly, testing, and packaging (“ATP” or “downstream”) capacity in key partner countries that will in turn diversify the global semiconductor supply chain. EB’s objectives under the ITSI Fund are to: 1) Expand and diversify the required workforce for semiconductor ATP facilities to ensure growth; and 2) Improve regulatory environments that will encourage private sector efforts that generate additional capabilities in ATP facilities. 

 

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Funding Type
Internal Deadline
External Deadline
08/16/2024
Solicitation Type

DOS DFOP0016764: 2024 FY24 EB ITSI Programs Philippines – Statements of Interest

Submit ticket request  // Limit:  2*  // Tickets Available: 2

 

Organizations may submit no more than two (2) SOIs and only one (1) SOI per category. The applicant must explicitly identify the category for each SOI submitted.

This solicitation is specific to the Philippines and includes two (2) categories under which applicants may submit SOIs: 

1) Workforce Development
2) Policy and Regulatory Reform.

 

The submission of the SOI is the first step in a two-step process. Applicants must first submit a concise no more than three (3) page statement of interest designed to clearly communicate the program idea and objectives. This is not a full proposal. The purpose of the SOI process is to allow applicants to submit program ideas for evaluation prior to requiring the development of a full proposal application. Upon a merit review of eligible SOIs, selected applicants will be invited to expand on their program idea(s) by submitting a full proposal application. Full proposals will go through a second merit review before final funding decisions are made.  

 

EB administers a portion of the ITSI Fund, the “ITSI Promote” line of effort, to help expand international semiconductor assembly, testing, and packaging (“ATP” or “downstream”) capacity in key partner countries that will in turn diversify the global semiconductor supply chain. EB’s objectives under the ITSI Fund are to: 1) Expand and diversify the required workforce for semiconductor ATP facilities to ensure growth; and 2) Improve regulatory environments that will encourage private sector efforts that generate additional capabilities in ATP facilities.

Funding Type
Internal Deadline
External Deadline
08/16/2024
Solicitation Type

DOS DFOP0016767: 2024 FY24 EB ITSI Programs Mexico – Statements of Interest

Submit ticket request  // Limit:  3*  // Tickets Available: 1

  • Limit of three and 1 per category.

Van Dyke. M ( College of Engineering)- 1) Workforce Development
Van Dyke. M ( College of Engineering) - 3) Supply Chain Development. 

This solicitation is specific to Mexico and includes three (3) categories under which applicants may submit SOIs: 

1) Workforce Development
2) Policy and Regulatory Reform
3) Supply Chain Development. 

The U.S. Department of State Bureau of Economic and Business Affairs (EB) announces an open competition for organizations to submit a statement of interest (SOI) to carry out a program under the International Technology Security and Innovation (ITSI) Fund, created by the CHIPS Act of 2022. Please carefully follow all instructions below. 

 

The submission of the SOI is the first step in a two-step process. Applicants must first submit a concise no more than three (3) page statement of interest designed to clearly communicate the program idea and objectives. This is not a full proposal. The purpose of the SOI process is to allow applicants to submit program ideas for evaluation prior to requiring the development of a full proposal application. Upon a merit review of eligible SOIs, selected applicants will be invited to expand on their program idea(s) by submitting a full proposal application. Full proposals will go through a second merit review before final funding decisions are made.  

 

EB administers a portion of the ITSI Fund, the “ITSI Promote” line of effort, to help expand international semiconductor assembly, testing, and packaging (“ATP” or “downstream”) capacity in key partner countries that will in turn diversify the global semiconductor supply chain. EB’s objectives under the ITSI Fund are to: 1) Expand and diversify the required workforce for semiconductor ATP facilities to ensure growth; and 2) Improve regulatory environments that will encourage private sector efforts that generate additional capabilities in ATP facilities. 

Funding Type
Internal Deadline
External Deadline
08/16/2024
Solicitation Type

DOS DFOP0016759: FY24 EB ITSI Programs Vietnam – Statements of Interest

Submit ticket request  // Limit:  2*  // Tickets Available: 1 

Organizations may submit no more than two (2) SOIs and only one (1) SOI per category. The applicant must explicitly identify the category for each SOI submitted.

Van Dyke. M ( College of Engineering)- 1) Workforce Development

 

  1. Category 1 – Workforce Development
  2. Category 2 – Policy and Regulatory Reform

The U.S. Department of State Bureau of Economic and Business Affairs (EB) announces an open competition for organizations to submit a statement of interest (SOI) to carry out a program under the International Technology Security and Innovation (ITSI) Fund, created by the CHIPS Act of 2022. Please carefully follow all instructions below. 

 

The submission of the SOI is the first step in a two-step process. Applicants must first submit a concise no more than three (3) page statement of interest designed to clearly communicate the program idea and objectives. This is not a full proposal. The purpose of the SOI process is to allow applicants to submit program ideas for evaluation prior to requiring the development of a full proposal application. Upon a merit review of eligible SOIs, selected applicants will be invited to expand on their program idea(s) by submitting a full proposal application. Full proposals will go through a second merit review before final funding decisions are made.  

 

EB administers a portion of the ITSI Fund, the “ITSI Promote” line of effort, to help expand international semiconductor assembly, testing, and packaging (“ATP” or “downstream”) capacity in key partner countries that will in turn diversify the global semiconductor supply chain. EB’s objectives under the ITSI Fund are to: 1) Expand and diversify the required workforce for semiconductor ATP facilities to ensure growth; and 2) Improve regulatory environments that will encourage private sector efforts that generate additional capabilities in ATP facilities. 

 

 

Award Floor: $1,000,000 

Award Ceiling: $5,000,000 

Program Performance Period: 36 months or less 

Funding Type
Internal Deadline
External Deadline
08/16/2024
Solicitation Type

National Semiconductor Technology Center (NSTC) Consortium: 2024 NSTC Workforce Partner Alliance (WFPA) program

Limit: 1 // J. M. Roveda  (Electrical and Computer Engineering)

 

Supporting the current semiconductor workforce and building the workforce of tomorrow are critical to the economic health and competitiveness of the United States. Jobs in the industry range from researchers to engineers to technicians and can offer gainful employment across the nation to workers from all demographic and socioeconomic backgrounds.

Making investments in the U.S. semiconductor workforce is an opportunity to serve underserved communities, to connect individuals to good-paying sustainable jobs across the country, and to develop a robust workforce ecosystem that supports an industry essential to the national and economic security of the U.S.

Funding Type
Internal Deadline
External Deadline
07/26/2014
Sponsor
Solicitation Type

DOE DE-FOA-0003289: FY 2025 Solar Energy Supply Chain Incubator

Submit ticket request  // Limit: 3*  // Tickets Available: 1 

 

An entity may submit only one Concept Paper and one Full Application for each topic area of this FOA.

 

With this FOA, SETO aims to promote innovative solar research, technology development, and product demonstration that can substantively increase U.S. domestic manufacturing across the solar energy supply chain and expand private investment in America’s solar manufacturing sector. These investments will help accelerate the growth of the solar industry, identify emerging opportunities, and drive down costs for our domestic energy market, positioning the United States on the leading edge of solar industry advances.

Topic Area 1: Solar Research and Technology Development
Topic Area 2: Solar Technology Demonstration
Topic Area 3: Solar Permitting Software Outreach, Education, and Development

Funding Type
Internal Deadline
External Deadline
10/07/2024

DOE DE-FOA-0003329: FY2025 Smart Manufacturing Technologies for Material and Process Innovation

Submit ticket request  // Limit:  4*  // Tickets Available: 1

 

*An entity may submit only one Concept Paper and one Full Application for each topic area of this FOA.

A. Anani (Department of Mining and Geological Engineering)– Topic 4: Smart Technologies for Sustainable and Competitive U.S. Mining 

 

Q. Hao (Aerospace and Mechanical Engineering) - Topic 3: Smart Manufacturing for High Performance Materials 

Topic Areas:

  • Topic 1: Smart Manufacturing for a Circular Economy 
  • Topic 2: Smart Manufacturing of Tooling and Equipment for Sustainable Transportation 
  • Topic 3: Smart Manufacturing for High Performance Materials 
  • Topic 4: Smart Technologies for Sustainable and Competitive U.S. Mining 

 

This funding opportunity announcement (FOA) is being issued by the U.S. Department of Energy’s (DOE) Advanced Materials and Manufacturing Technologies Office (AMMTO). The mission of AMMTO is: “We inspire people and drive innovation to transform materials and manufacturing for America's energy future.” This is in alignment with AMMTO’s vision for the future – a globally competitive U.S. manufacturing sector that accelerates the adoption of innovative materials and manufacturing technologies in support of a clean, decarbonized economy.

This FOA seeks applications to address the development of smart manufacturing technologies –including through “smart RD&D” – that can contribute to a resilient, responsive, leading-edge, and efficient manufacturing sector that delivers the technologies needed for the nation’s clean energy transition. The manufacturing community can reduce manufacturing costs and accelerate time-to-market by integrating performance characteristics of final products with processes aided by a smart manufacturing framework. The information-driven collaborative orchestration of physical and digital processes across the entire value chain is one aspect of smart manufacturing. Smart manufacturing relies on a combination of physical and virtual technologies to make designing, processing, and manufacturing faster, higher value-added, more resilient, sustainable, and more cost-effective. Individual processes within a plant, factory, or entire value chain are integrated and continually monitored with sensing, process modeling, and predictive analytics. The physical processes focus on controlling and optimizing processing conditions for desired outcomes, while virtual processes uncover underlying complex interactions between the physical processes and provide insight into better ways to design and manufacture products (i.e., feedback for physical processes). This FOA seeks to implement smart manufacturing across several diverse application areas and market sectors to: (a) show the benefits of incorporating smart manufacturing in areas aligned with AMMTO’s mission, and (b) to provide practical experience which will be used to further refine AMMTO’s smart manufacturing strategy and future R&D direction.

Funding Type
Internal Deadline
External Deadline
08/22/2024 ( Concept paper)
Sponsor
Solicitation Type