United States Department of Commerce (DOC)

DOC CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates

Institutionally Coordinated // Limit: 1 // L. Folks (Semiconductor Strategy)

 

Please contact the Center for Semiconductor Manufacturing (CSM)  for more information. 

Eligible applicants can only submit one concept plan paper under this NOFO.

 

Program Priorities

External Deadline
04/12/2024 (Concept paper) - 7/03/2024 (Proposal)
Internal Deadline
Feb. 21, 2024