United States Department of Commerce (DOC)

US Dept of Commerce NTIA: NTIA-DECGP-2024

1 Ticket / 0 Available

Angela Cruze (Inst Future Data Computation)

 

 

 

This Notice of Funding Opportunity solicits applications for the Digital Equity Competitive Grant Program (“Competitive Grant Program” or “Program”), the third of three digital equity programs authorized by the Infrastructure Investment and Jobs Act of 2021, Division F, Title III, Public Law 117-58, 135 Stat. 429, 1209 (November 15, 2021) (“Infrastructure Act”) also known as the (“Digital Equity Act” or “DE Act”). The Digital Equity Act appropriated $2.75 billion to be awarded by the Assistant Secretary of Commerce for Communications and Information (“Assistant Secretary”) to promote digital equity and inclusion.

The Digital Equity Act consists of three funding programs:

  1. the $60 million State Digital Equity Planning Grant Program;
  2. the $1.44 billion State Digital Equity Capacity Grant Program; and
  3. the $1.25 billion Competitive Grant Program.

The Digital Equity Planning Grant Program was launched in May of 2022 and is now complete. Under the Planning Grant Program, 56 States and U.S. Territories created Digital Equity Plans that identified the barriers to digital equity faced by certain populations defined by the statute (i.e., “Covered Populations”)1 and measurable objectives for addressing those barriers. The State Digital Equity Capacity Grant Program Notice of Funding Opportunity was released on March 29, 2024, and will provide funds to States and U.S. Territories to implement the Digital Equity Plans created through the Digital Equity Planning Grant Program, as well as provide funds for Indian Tribes, Alaska Native entities, and Native Hawaiian organizations (“Native Entities”) to address the digital equity needs of the Covered Populations within those communities. The Capacity Grant Program is on-going and will continue to address the needs of the Covered Populations as identified in the State and U.S. Territories’ Digital Equity Plans and as identified by Native Entities.

The Competitive Grant Program will make funds available to a wide range of entities to address barriers to digital equity faced by Covered Populations as defined by 47 U.S.C. §1721(8). The Competitive Grant Program will support efforts to achieve digital equity, promote digital inclusion activities, and spur greater adoption and meaningful use of broadband among the Covered Populations. Specifically, the Digital Equity Act authorizes funds to be used for the development and implementation of digital inclusion activities that benefit the Covered Populations; programs that facilitate the adoption of broadband by Covered Populations to provide educational and employment opportunities; training programs that cover basic, advanced, and applied skills; workforce development programs; access to equipment, instrumentation, networking capability, hardware and software, or digital network technology for broadband services at low or no cost; and the construction or operation of public access computing centers for Covered Populations. Awards will focus on addressing the needs of the Covered Populations not met by the Capacity Grant Program and will strive for a diverse pool of recipients. To ensure funds are directed to the most effective programs with the greatest reach, and to minimize administrative overhead, NTIA encourages proposals that demonstrate a broad partnership of entities with the ability to administer significant resources and address the varied concerns of the Covered Populations.

 

DOC 2024: NTIA-PWSCIF-24-01 Public Wireless Supply Chain Innovation Fund Grant Program - Open Radio Commercialization and Innovation

Submit ticket request  // Limit: 4* // Tickets Available: 4

 

*Each applicant may submit a maximum of one SRFA 1 application and three SRFA 2 applications.

This NOFO is the second in a series that NTIA will issue and administer under the Public Wireless Supply Chain Innovation Fund (Innovation Fund). This NOFO is divided into two topic areas: open radio unit (RU) commercialization and open RU innovation. Throughout this document, open RU commercialization is referred to as “specific research focus area 1” (SRFA 1) and open RU innovation is referred to as “specific research focus area 2” (SRFA 2). A brief description of each SRFA is below:
 

• SRFA 1: Accelerating the development of open RU products to the point where they meet carrier needs and are ready for commercial trials; and
• SRFA 2: Improving the overall performance and capabilities of open RUs through targeted research and development.

Applications in response to this NOFO must address either SRFA 1 or SRFA 2. A single application cannot address both SRFAs. If an application is submitted addressing both SRFAs, it will be rejected. Applicants interested in applying for both SRFAs must submit a separate application for each SRFA. Applicants may only include one project per application, regardless of SRFA. Individual submissions containing multiple proposed projects will be rejected. Each applicant may submit a maximum of one SRFA 1 application and three SRFA 2 applications. Each SRFA 2 application must address at least one, and may address more than one, topic area listed in Section 3.3.1.

 

NTIA will award up to $420,000,000 under this NOFO. The amount of funding NTIA expects to award per project differs by SRFA, as follows:
• SRFA 1: NTIA expects to award $25,000,000-$45,000,000 per project.
• SRFA 2: NTIA expects to award $5,000,000-$10,000,000 per project.

Funding Type
Internal Deadline
External Deadline
07/10/2024

DOC CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates

Institutionally Coordinated // Limit: 1 // L. Folks (Semiconductor Strategy)

 

Please contact the Center for Semiconductor Manufacturing (CSM)  for more information. 

Eligible applicants can only submit one concept plan paper under this NOFO.

 

Program Priorities

“Advanced packaging” refers to many chips with diverse functions assembled tightly together on a substrate in two or three dimensions at extremely fine dimensions. This method achieves function, performance, and power savings far greater than can be achieved with conventionally packaged chips on a printed circuit board. Recent advances in artificial intelligence, for example, would not be possible without advanced packaging.

Advanced packaging can be a transformative capability that helps U.S. manufacturers compete globally, but there are many technological challenges to solve. The CHIPS Research and Development Office has established the CHIPS National Advanced Packaging Manufacturing Program to address these challenges, including:

• How do we design and assemble chips so tightly that they behave like a single traditional large chip, but with the production efficiency and cost savings of advanced packaging?

• How do we supply power to and dissipate heat from such tightly coupled assemblies?

• How do we test and repair such complex assemblies?

 

 

• How do we ensure their reliability since traditional methods of visual inspection cannot be performed on such small, tightly packaged dimensions?

The CHIPS NAPMP will enable the development of a robust domestic advanced packaging ecosystem by:

• Establishing an advanced packaging piloting facility (or facilities) that accelerates the transfer of innovations in packaging, equipment, and process development into manufacturing;

• Driving the development of digital tools to reduce the time and cost of advanced packaging engineering; and,

• Establishing and supporting partnerships among industry, academia and training entities, and government to contribute to an advanced packaging workforce.

 

The six priority research investment areas of the CHIPS NAPMP are:

• Materials and substrates

• Equipment, tools, and processes

• Power delivery and thermal management for advanced packaging assemblies

• Photonics and connectors that communicate with the outside world

• A chiplet ecosystem

• Co-design of multi-chiplet systems with automated tools

Funding Type
Internal Deadline
External Deadline
04/12/2024 (Concept paper) - 7/03/2024 (Proposal)