National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)

Limit: 5 // Available: 5

Applications such as high performance computing and lowpower electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging. This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).

The submission of a concept paper is required. Eligible applicants may submit only one concept paper per R&D Area. Each concept paper may only include one R&D Area. Applicants may submit separate concept papers on different R&D Areas.